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this is information on a product in full production. june 2014 docid026031 rev 2 1/11 11 BALF-NRF01D3 50 ? nominal input / conjugate match balun to nrf51822-qfaag0 /qfabb0 and nrf51422-qfaae0 with integrated harmonic filter datasheet ? production data features ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? coated flip-chip on glass ? small footprint: < 1.5 mm 2 benefits ? very low profile: < 560 m after reflow ? high rf performance ? pcb space saving versus discrete solution ? bom count reduction ? efficient manuf acturability applications ? 2.45 ghz balun with integrated matching network ? matching optimized for following chipsets: nrf51822-qfaag0/gc/fa, nrf51822- qfabb0 and nrf 51422-qf aae0 description stmicroelectronics BALF-NRF01D3 is an ultraminiature balun. the BALF-NRF01D3 integrates matching network in a monolithic glass substrate. matching impedance has been customized for the nrf51822-qfaag0/gc/fa, nrf51822-qfabb0 and nrf51422-qfaae0 rf transceivers. the BALF-NRF01D3 uses stmicroelectronics ipd technology on non-conductive glass substrate which optimize rf performances. figure 1. pinout diagram (top view) lead-free flip-chip package 5 bumps se diff diff vcc gnd a b c 1 2 3 www.st.com
characteristics BALF-NRF01D3 2/11 docid026031 rev 2 1 characteristics table 1. absolute maximum ratings (limiting values) symbol parameter value unit min. typ. max. p in input power rf in 20 dbm v esd esd ratings mil std883c (hbm: c = 100 pf, r = 1.5 k ? , air discharge) 2000 v esd ratings charge device model (jesd22-c101-c) 500 esd ratings machine model (mm: c = 200 pf, r = 25 ? , l = 500 nh) 500 t op operating temperature -40 +85 c table 2. electrical characteristics(t amb = 25 c) symbol parameter value unit min. typ. max. z out nominal differential output impedance conjugate match to: ? nrf51822-qfaag0/gc/fa ? nrf51822-qfabb0 ? nrf51422-qfaae0 ? z in nominal input impedance 50 ? f frequency range (bandwidth) 2400 2540 i l insertion loss in bandwidth 1.35 1.46 db r l return loss in bandwidth 16.5 17 17.5 db imb phase imbalance 4.5 5 5.5 aimb amplitude imbalance 0.15 0.2 0.25 db 2f0 2nd harmonic filtering -15 -14 db 3f0 3rd harmonic filtering -42 -41 db
docid026031 rev 2 3/11 BALF-NRF01D3 characteristics 1.1 simulations results (t amb = 25 c) figure 2. insertion loss in band figure 3. differential transmission f (ghz) -1.00 -1.05 -1.10 -1.15 -1.20 -1.25 -1.30 -1.35 -1.40 -1.45 -1.50 2.40 2.44 2.54 2.42 2.46 2.50 2.48 2.52 db -50 0123 4 5 6 78 -0 -10 -20 -30 -40 db f (ghz) figure 4. return loss on se port figure 5. amplitude imbalance f (ghz) -17.0 -17.5 -18.0 -18.5 -18.5 2.40 2.44 2.54 2.42 2.46 2.50 2.48 2.52 db 2.40 2.44 2.54 2.42 2.46 2.50 2.48 2.52 db 0.5 -0.1 -0.3 -0.2 -0.4 -0.5 0.3 0.1 0.0 0.4 0.2 f (ghz) figure 6. phase imbalance figure 7. h2 attenuation 0 1 2 3 4 5 6 7 8 9 10 2.40 2.44 2.54 2.42 2.46 2.50 2.48 2.52 deg f (ghz) f (ghz) -14.0 -14.5 -15.0 -16.5 -15.5 -17.0 -16.0 -17.5 4.80 4.90 5.10 4.85 4.95 5.00 5.05 db
characteristics BALF-NRF01D3 4/11 docid026031 rev 2 figure 8. attenuation in h3 7.20 7.25 7.30 7.35 7.40 7.45 7.50 7.55 7.60 7.65 -40 -42 -44 -46 -48 -50 db f (ghz)
docid026031 rev 2 5/11 BALF-NRF01D3 application information 2 application information figure 9. application schematic BALF-NRF01D3 please note that the capacitance longer on se port (pin 5) is no needed. r1 nc
package information BALF-NRF01D3 6/11 docid026031 rev 2 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. package dimensions (top and side view) figure 11. footprint - non solder mask defined figure 12. footprint - solder mask defined 600 m 219 m 219 m 205 m se gnd vcc diff diff 1000 50 m 500 m 1500 50m 500 m 433 m 400 m 630 m 60 copper pad diameter: 220m recommended 180m minimum 260m maximum solder mask opening: 320m recommended 300m minimum 340m maximum solder stencil opening: 220m recommended line to connect copper pad on solder mask opening shopuld be smaller than copper pad diameter solder mask opening: 220m recommended 180m minimum 260m maximum copper pad diameter: 320m recommended 300m minimum solder stencil opening : 220m recommended
docid026031 rev 2 7/11 BALF-NRF01D3 package information figure 13. pcb layout recommendation figure 14. BALF-NRF01D3 position = BALF-NRF01D3 *do not implement any capacitane on se port (pin 5) center of qfn land pattern to bal -nrf01d3 bump center f 960 m
package information BALF-NRF01D3 8/11 docid026031 rev 2 figure 15. marking figure 16. flip-chip tape and reel specifications note: more information is available in the stmicroelectronics application note: an2348 flip-chip: ?package description and recommendations for use? x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.71 1.1 0.22 1.57 st st st xxz xxz xxz yww yww yww
docid026031 rev 2 9/11 BALF-NRF01D3 package information df-st = nrf51822 reference layout files with stmicroelectronics balun. table 3. compatibility matrix device marking balun variant and design files packet/variant build code qfaa ca bal-nrf01d3 + 0.8pf df-st v1.0 c0 bal-nrf01d3 + 0.8pf df-st v1.0 fa bal f -nrf01d3 df-st v1.x gc bal f -nrf01d3 df-st v1.x g0 bal f -nrf01d3 df-st v1.x qfab aa bal-nrf01d3 + 0.8pf df-st v1.0 a0 bal-nrf01d3 + 0.8pf df-st v1.0 b0 bal f -nrf01d3 df-st v1.x table 4. compatibility matrix (nrf51422)) device marking balun variant and design files packet/variant build code qfaa c0 bal-nrf01d3 + 0.8pf ca bal-nrf01d3 + 0.8pf e0 BALF-NRF01D3 qfab a0 BALF-NRF01D3
ordering information BALF-NRF01D3 10/11 docid026031 rev 2 4 ordering information 5 revision history table 5. ordering information order code marking weight base qty delivery mode BALF-NRF01D3 st 1.82 mg 5000 tape and reel table 6. document revision history date revision changes 27-mar-2014 1 initial release 04-jun-2014 2 updated all curves and added table 4 .
docid026031 rev 2 11/11 BALF-NRF01D3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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